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Through-hole technology

Through-hole technology

Circuit board manufacturing technique.

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Readers' pathsAug 2026 – Oct 2026

Readers go next to

Share of the 617 clicks on its links

  1. Point-to-point construction

    Making an electronic circuit by directly connecting the leads of the components.

    35%

  2. Surface-mount technology

    Method for producing electronic circuits.

    23%

  3. Via (electronics)

    Type of electrical connection.

    14%

  4. Printed circuit board

    Board to support and connect electronic components.

    4.9%

  5. Lead (electronics)

    Electrical connection consisting of a length of wire or a metal pad.

    2.4%

  6. TO-220

    Power semiconductor through-hole package.

    1.6%

Readers come from

Share of the 912 readers arriving from another article

  1. Surface-mount technology

    Method for producing electronic circuits.

    54%

  2. Printed circuit board

    Board to support and connect electronic components.

    8.7%

  3. Integrated circuit packaging

    Final stage of semiconductor device fabrication.

    8%

  4. Dual in-line package

    Type of electronic component package.

    6.9%

  5. Light-emitting diode

    Semiconductor light source.

    6.5%

  6. Via (electronics)

    Type of electrical connection.

    5.2%

  7. Zero-ohm link

    Electrical component used to link traces.

    3.2%

  8. Resistor

    Passive electronic component providing electrical resistance.

    1.2%

  9. Footprint (electronics)

    Pattern used in circuit board production.

    1.1%