Lead frame
Lead frame
Metal structure inside a chip package that carries signals from the die to the outside.
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Readers' pathsAug 2026 – Oct 2026
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Quad flat package
Surface mount integrated circuit package with "gull wing" pins extending from all sides.
25%
Chip carrier
Surface mount technology package for integrated circuits.
24%
Flat no-leads package
Integrated circuit package with contacts on all 4 sides, on the underside of the package.
21%
Wire bonding
Technique used to connect a microchip to its package.
13%
Integrated circuit packaging
Final stage of semiconductor device fabrication.
8.1%
Die (integrated circuit)
Unpackaged integrated circuit.
8.1%
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